Advancing Semiconductor Manufacturing through Supercritical Fluid Extrusion: A Sustainable and Efficient Methodology

Authors

  • Nitya Gopal Mondal Cornell University, Ithaca, New York, United States

DOI:

https://doi.org/10.53469/jrse.2025.07(11).14

Keywords:

Supercritical Fluid Extrusion, Semiconductor Processing, Sustainable Manufacturing, Thin Film Deposition, Contaminant Removal

Abstract

Supercritical fluid extrusion (SCFE) is an emerging technology with significant potential to revolutionize semiconductor processing. Traditional methods often rely on harsh chemicals, high temperatures, and vacuum environments, posing challenges in terms of environmental impact, material compatibility, and processing limitations. SCFE, utilizing supercritical fluids (most commonly carbon dioxide) as tunable solvents and transport media, offers a compelling alternative. This abstract examines the application of SCFE in diverse aspects of semiconductor manufacturing, including the deposition of thin films and nanomaterials, the removal of contaminants and residues, and the creation of advanced packaging structures. The unique properties of supercritical fluids—such as their high diffusivity, low viscosity, and tunable solvent power—enable precise control over processing conditions, improved material purity, and enhanced device performance. Moreover, SCFE's inherent sustainability offers reduced waste generation and lower energy consumption, aligning with the increasing demand for eco - friendly semiconductor manufacturing. This technology holds promise for enabling the development of smaller, faster, and more efficient semiconductor devices while simultaneously addressing the industry's growing environmental concerns.

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Published

2025-11-28

How to Cite

Mondal, N. G. (2025). Advancing Semiconductor Manufacturing through Supercritical Fluid Extrusion: A Sustainable and Efficient Methodology. Journal of Research in Science and Engineering, 7(11), 63–64. https://doi.org/10.53469/jrse.2025.07(11).14

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