Simulation and Design of a Temperature Compensation Circuit for a Radio Frequency Power Amplifier

Authors

  • Yonghua Ma Beijing Union University, Beijing 100101, China
  • Jiong Gao Beijing Union University, Beijing 100101, China; College of Education, Capital Normal University, Beijing, 100089 China
  • Boyi Chen School of Artificial Intelligence and Computer Science, Northern University of Technology, Beijing 100144, China; School of Beijing, Beihang University, Beijing 100191, China

DOI:

https://doi.org/10.53469/jrse.2025.07(08).12

Keywords:

Power amplifier, ADS and MATLAB modeling simulation, TINA-TI design, Temperature compensation circuit

Abstract

Power amplifiers made with the third-generation semiconductor material GaN (Gallium Nitride) are more suitable for 5G technology. However, the turn-on voltage of GaN power amplifiers decreases with temperature rise and has a large variation, showing a significant quadratic characteristic, which leads to the deterioration of the linearity of the static working current. In order to reduce this linear deterioration, this paper achieves the adjustment of the gate voltage VGS at different temperatures through modeling and simulation in software ADS, MATLAB, and reasonable circuit construction in TINA-TI, maintaining the stability of the static bias current. This method has a wide range of applications in GaN RF power amplifiers.

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Published

2025-08-31

How to Cite

Ma, Y., Gao, J., & Chen, B. (2025). Simulation and Design of a Temperature Compensation Circuit for a Radio Frequency Power Amplifier. Journal of Research in Science and Engineering, 7(8), 62–64. https://doi.org/10.53469/jrse.2025.07(08).12

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